Separate test electronics and blower modules in an apparatus for testing an integrated circuit

ABSTRACT

The invention relates to an apparatus for testing an integrated circuit of an electronic device.

BACKGROUND OF THE INVENTION

This invention relates to test equipment for testing devices havingelectrical circuits including integrated circuits.

When fabrication of electronic devices, such as computer processors andmemories, has been completed, the electronic devices are subjected toburn-in and electrical testing in order to identify and eliminatedefective devices before shipment. The term “burn-in” relates tooperation of an integrated circuit at a predetermined temperature ortemperature profile, typically an elevated temperature in an oven.Certain operating electrical bias levels and/or signals are supplied tothe electronic devices while they are at the elevated temperature. Theuse of the elevated temperature, electrical bias and functional inputsignals accelerates stress to which the devices are subjected duringburn-in, so that marginal devices that would otherwise fail shortlyafter being placed in service fail during burn-in, and are, thereforenot shipped.

SUMMARY OF THE INVENTION

The invention relates to an apparatus for testing an integrated circuitof an electronic device, including an apparatus frame, a power sourcemounted to the apparatus frame, a power electrical path connecting thepower source to power contacts on the electronic device, a signalsource; and a plurality of signal electrical paths, each connecting thesignal source to a respective signal contact on the electronic device.

The apparatus may further include a blower mounted to the apparatusframe, the blower blowing air through at least part of the apparatusframe.

In the apparatus, the apparatus frame may include a test electronicsframe and a blower frame, the power source and the signal source beinglocated in the test electronics frame and jointly forming part of a testelectronics module, and the blower being mounted the blower frame andjointly being part of a blower module, the test electronics module andthe blower module being removably mounted to one another.

In the apparatus, the apparatus frame may further include a driverelectronics part and an oven part, the blower being an oven blower andthe blower frame being an oven blower frame housing the electronicsdevice, the oven blower being mounted to the oven blower frame andjointly being part of an oven blower module, the oven blower blowing airthrough the oven blower part.

In the apparatus, the apparatus frame may further include a driverblower frame, further including a driver electronics blower mounted tothe driver electronics blower frame and jointly being part of a driverelectronics blower module, the driver blower blowing air through thedriver electronics part, the test electronics module and the driverelectronics module being removably mounted to one another.

The apparatus may further include a blower bearing mount secured to theapparatus frame, wherein the blower includes a blower bearing held bythe lower bearing mount, a blower input shaft held by the blower bearingand being rotatable relative to the blower bearing mount; and a fanmounted on the shaft to rotate together with the shaft.

The apparatus may further include a blower motor bearing mount securedto the apparatus frame, a blower motor including, a blower motor bodysecured to the apparatus frame, a blower motor stator held by the blowermotor body, a blower motor rotor rotatably held by the blower motorbody, a blower motor output shaft connected to the blower motor rotorfor rotation therewith, the blower input shaft being driven by theblower motor output shaft.

The apparatus may further include a blower motor pulley connected to theblower motor output shaft, a blower pulley connected to the blower inputshaft; and a drive belt running over the motor pulley and the blowerpulley.

The apparatus may further include spacer component between the apparatusframe and a selected one of the mounts, the spacer component beingremovable to permit removal of the drive belt.

In the apparatus, the selected mount may be the blower bearing mount,the blower pulley being located between the blower bearing and the fan.

The apparatus may further include first and second sets of opposingrails, first and second sides of a respective device holder beingreleasably held by opposing rails of the first and second sets of rails.

The apparatus may further include a device holder substrate, a pluralityof device holder terminals on the device holder substrate, each forcontacting a respective contact on a respective electronic device, aplurality of device holder signal contacts secured to the device holdersubstrate, each device holder signal contact having a surface forreleasably mating with a respective surface of a respective signalconnector terminal, a plurality of device holder signal conductorsconnecting the device holder signal contacts to device holder terminalsconnected to signal contacts on the electronic devices, a power contactsecured to the device holder substrate, the power connector having acontact surface for releasably mating with a respective surface of arespective power connector terminal; and at least one device holderpower conductor connecting the device holder board power contact to apower contacts on one of the electronic devices.

The apparatus my further include an interior frame that is removablylocated within the apparatus frame, the interior frame having first andsecond opposing vertical sides and the first and second sets of opposingrails being located on first and second opposing side walls,respectively, of the subframe.

In the apparatus, the interior frame may have third and fourth opposingside walls, further including third and fourth sets of opposing railsbeing located on the third and fourth opposing vertical sides of thesubframe, first and second sides of a first electronics board beingreleasably held by opposing rails of the third and fourth sets of railsand the first electronics board electrically connecting to the deviceholder subassembly.

In the apparatus, the interior frame may have a fifth vertical sideopposing the fourth side wall, further including fifth and sixth sets ofopposing rails being located on the fourth and fifth opposing verticalsides of the subframe, first and second sides of a second electronicsboard being releasably held by opposing rails of the fifth and sixthsets of rails and the second electronics board electrically connectingto the device holder subassembly.

The apparatus may further include a first module including a firstconnector including a connector body, a first set of connector terminalson the connector body for connecting to respective ones of a first setof device holder contacts of a device holder, a first set of connectorcontacts on the connector body for connecting to respective ones of afirst set of board terminals of a board; and a first set of connectorconductors carried by the connector body and connecting the first set ofconnector terminals to the first set of connector contacts.

The apparatus may further include a second set of connector terminals onthe connector body, the second set of connector terminals being spacedfrom the first set of connector terminals in a direction that the deviceholder engages with the connector body.

In the apparatus, the device holder may include first and second sets ofdevice holder contacts spaced from one another on a device holdersubstrate and contacting the first and second sets of connectorterminals respectively.

In the apparatus, the device holder may further include a second set ofconnector contacts on the connector body, the second set of connectorcontacts being spaced from the first set of connector contacts in adirection that the board engages with the connector body.

In the apparatus, the first set of connector conductors may connect thefirst connector terminals with the first connector contacts, furtherincluding a second set of connector conductors connecting the second setof connector contacts with the second set of connector terminals.

The apparatus may further include a first set of terminal springportions, each terminal spring portion of the first set of terminalspring portions urging a respective connector terminal of the first setof connector terminals against a respective board contact of the firstset of board contacts, a second set of terminal spring portions, eachterminal spring portion of the second set of terminal spring portionsurging a respective connector terminal of the second set of connectorterminals against a respective board contact of the second set of boardcontacts, a first set of contact spring portions, each contact springportion of the first set of contact spring portions urging a respectiveconnector contact of the first set of connector contacts against arespective board contact of the first set of board contacts; and asecond set of terminal spring portions, each terminal spring portion ofthe second set of terminal spring portions urging a respective connectorterminal of the second set of connector terminals against a respectiveboard terminal of the second set of board terminals.

In the apparatus, the board may include first and second sets of boardterminals spaced from one another on a board substrate and contactingthe first and second sets of connector contacts respectively.

The apparatus may further include a first insulation piece securedagainst the connector body.

In the apparatus, the first integrated module may include a feedthroughboard including, a feedthrough board substrate, and a first feedthroughboard electric conductor carried by the feedthrough board substrate andconnected to the first connector contact, the first insulation piecebeing located against the feedthrough board substrate.

In the apparatus, the first integrated module may further include asecond insulation piece secured to the connector body on an oppositeside to the first insulation piece.

In the apparatus, the first integrated module may further include afeedthrough board including a feedthrough board substrate, and a firstfeedthrough board electric conductor carried by the feedthrough boardsubstrate and connected to the first connector contact, the first andsecond insulation pieces being located against and on opposite sides ofthe feedthrough board substrate.

The apparatus may further include a plurality of said integrated modulesjointly forming an insulated wall.

The apparatus may further include a first driver board including a firstdriver board substrate, a first driver board electric conductor carriedby the driver board substrate, and a first driver board terminalconnected to the first driver board electric conductor, a first one ofthe connector contacts being electrically connected to the first driverboard terminal.

In the apparatus, the first connector contact may be offset from a lineat right angles to a side of the driver board substrate at the driverboard terminal.

The apparatus may further include a backplane board including abackplane substrate, and a first backplane electric conductor carried bythe backplane substrate and extending from a first driver board terminalplane through the first diver board terminal to a first connectorcontact plane through the first connector contact, the first driverboard terminal plane and the first connector contact plane being spacedand parallel to one another, the first backplane electric conductorconnecting the first driver board terminal and the first connectorcontacts electrically to one another.

In the apparatus, the first connector contact plane may be parallel toand offset from a plane of the driver board substrate.

The apparatus may further include a feedthrough board including afeedthrough board substrate, and a first feedthrough board electricconductor carried by the feedthrough board substrate and extending in adirection other than at right angles to a plane of the first driverboard substrate, the first feedthrough board electric conductorconnecting the first driver board terminal and the first connectorcontacts electrically to one another.

In the apparatus, the first feedthrough board electric conductor mayextend in a direction other than at right angles to a plane of the firstdriver board substrate.

In the apparatus, the first connector contact may be offset from thefirst driver board terminal in a direction parallel to a plane of thedriver board substrate.

The apparatus may further include a second driver board including asecond driver board substrate, a second driver board electric conductorcarried by the driver board substrate; and a second driver boardterminal connected to the second driver board electric conductor, thesecond driver board terminal being connected to the first driver boardterminal.

The apparatus may further include a feedthrough board including afeedthrough board substrate, and a feedthrough board electric conductorcarried by the feedthrough board substrate and connecting the first andsecond driver board terminals to one another.

The apparatus may further include a first backplane board including afirst backplane substrate, and a first backplane electric conductorcarried by the first backplane substrate and connecting the first driverboard terminal and the feedthrough board electric conductor electricallyto one another; and a second backplane board including a secondbackplane substrate separate from the first backplane substrate, and asecond backplane electric conductor carried by the second backplanesubstrate and connecting the second driver board terminal and thefeedthrough board electric conductor electrically to one another.

In the apparatus, the first and second backplane substrates may extendin a plane that is at right angles to planes of the first and seconddriver board substrates and a plane of the feedthrough substrate.

In the apparatus, the first driver board may be a power board and thesecond driver board may be a signal board.

In the apparatus, the apparatus frame may define a door opening, furtherincluding a first translation system mounted to the apparatus frame, afirst hinge base mounted to the first translation system, the firsttranslation system allowing for translation of the first hinge baserelative to the apparatus frame between a storage position and anoperational position a door panel mounted to the first hinge base, thedoor panel being pivotally movable relative to the first hinge base whenthe first hinge base is in the operational position between a storageorientation wherein the door opening is open and an closed orientationwherein the door panel closes the door opening, and a latch mechanismthat releasably maintains the door in the closed position.

In the apparatus, the apparatus frame may define a door opening, furtherincluding a second translation system mounted to the apparatus frame, asecond hinge base mounted to the second translation system, the secondtranslation system allowing for translation of the second hinge baserelative to the apparatus frame between the storage position and theoperational position, the door panel being mounted to the second hingebase, the door panel being pivotally movable relative to the secondhinge base when the hinge base is in the operational position betweenthe storage orientation wherein the door opening is open and the closedorientation wherein the door panel closes the door opening.

In the apparatus, the first and second translation systems may be upperand lower translation systems and the door pivots about an axis that issubstantially vertical.

The apparatus may further include a connecting structure that securesthe first and second hinge bases to one another.

In the apparatus, the first translation system may include a first trackthat is mounted to the apparatus frame and a first wheel that isrotatably mounted to the first pivot base, the first wheel having anouter surface that rides on the rail.

The invention further provides a device holder subassembly, including adevice holder substrate, a plurality of device holder terminals on thedevice holder substrate, each for contacting a respective contact on arespective electronic device, a plurality of device holder signalcontacts secured to the device holder substrate, each device holdersignal contact having a surface for releasably mating with a respectivesurface of a respective signal connector terminal, a plurality of deviceholder signal conductors connecting the device holder signal contacts todevice holder terminals connected to signal contacts on the electronicdevices, a power contact secured to the device holder substrate, thepower connector having a contact surface for releasably mating with arespective surface of a respective power connector terminal, and atleast one device holder power conductor connecting the device holderboard power contact to a power contacts on one of the electronicdevices.

In the device holder assembly, the connector terminals may include firstand second sets of connector terminals, the second set of connectorterminals being spaced from the first set of connector terminals in adirection that the device holder engages with the connector body.

In the device holder assembly, the device holder may include first andsecond sets of device holder contacts spaced from one another on adevice holder substrate and contacting the first and second sets ofconnector terminals respectively.

The invention further provides a method of testing an integrated circuitof an electronic device, including holding the device against a surfaceof a first device holder so that signal and power terminals of theholder are in contact with signal and power contacts on the electronicdevice, providing signals through the signal terminals and contacts tothe integrated circuit, providing power through the power terminals andcontacts to the integrated circuit.

The method may further include blowing air with a blower through atleast part of the apparatus frame.

In the method, the apparatus frame may include a test electronics frameand a blower frame, the power source and the signal source being locatedin the test electronics frame and forming part of a test electronicsmodule, and the blower being mounted the blower frame and being part ofa blower module, further including removably mounting the testelectronics module and the blower module to one another.

In the method, the apparatus frame may include a driver electronics partand an oven part, the blower being an oven blower and the blower framebeing an oven blower frame housing the electronics device, the ovenblower being mounted to the oven blower frame and jointly being part ofan oven blower module, the oven blower blowing air through the ovenblower part.

In the method, the apparatus frame may include a driver blower frame, adriver electronics blower mounted to the driver electronics blower frameand jointly being part of an driver electronics blower module, furtherincluding removably mounting the test electronics module and the driverelectronics module removably to one another for the driver blower toblow air through the driver electronics part.

The method may further include releasably holding first and second sidesof a respective device holder by a opposing rails of first and secondsets of rails.

The method may further include removing an interior frame out of theapparatus frame, the first and second sets of opposing rails beinglocated on first and second opposing vertical sides of the subframe.

In the method, the third and fourth sets of opposing rails may belocated on third and fourth opposing vertical sides of the subframe,first and second sides of the first electronics board being releasablyheld by opposing rails of the third and fourth sets of rails and thefirst electronics board electrically connecting to the device holdersubassembly.

In the method, the fifth and sixth sets of opposing rails may be locatedon the fourth and a fifth opposing vertical sides of the subframe, firstand second sides of the second electronics board being releasably heldby opposing rails of the fifth and sixth sets of rails and the secondelectronics board electrically connecting to the device holdersubassembly.

The invention further provides a module including a first connectorincluding, a connector body, a first set of connector terminals on theconnector body for connecting to respective ones of a first set ofdevice holder contacts of a device holder, a first set of connectorcontacts on the connector body for connecting to respective ones of afirst set of board terminals of a board, and a first set of connectorconductors carried by the connector body and connecting the first set ofconnector terminals to the first set of connector contacts.

The module may further include a second set of connector terminals onthe connector body, the second set of connector terminals being spacedfrom the first set of connector terminals in a direction that the deviceholder engages with the connector body.

In the module, the device holder may include first and second sets ofdevice holder contacts spaced from one another on a device holdersubstrate and contacting the first and second sets of connectorterminals respectively.

The module may further include a second set of connector contacts on theconnector body, the second set of connector contacts being spaced fromthe first set of connector contacts in a direction that the boardengages with the connector body.

In the module, the first set of connector conductors may connect thefirst connector terminals with the first connector contacts, furtherincluding a second set of connector conductors connecting the second setof connector contacts with the second set of connector terminals.

The module may further include a first set of terminal spring portions,each terminal spring portion of the first set of terminal springportions urging a respective connector terminal of the first set ofconnector terminals against a respective board contact of the first setof board contacts, a second set of terminal spring portions, eachterminal spring portion of the second set of terminal spring portionsurging a respective connector terminal of the second set of connectorterminals against a respective board contact of the second set of boardcontacts, a first set of contact spring portions, each contact springportion of the first set of contact spring portions urging a respectiveconnector contact of the first set of connector contacts against arespective board contact of the first set of board contacts; and asecond set of terminal spring portions, each terminal spring portion ofthe second set of terminal spring portions urging a respective connectorterminal of the second set of connector terminals against a respectiveboard terminal of the second set of board terminals.

In the module, the board may include first and second sets of boardterminals spaced from one another on a board substrate and contactingthe first and second sets of connector contacts respectively.

The module may further include a first insulation piece secured againstthe connector body.

In the module, the first integrated module may further include afeedthrough board including a feedthrough board substrate, and a firstfeedthrough board electric conductor carried by the feedthrough boardsubstrate and connected to the first connector contact, the firstinsulation piece being located against the feedthrough board substrate.

In the module, the first integrated module may further include a secondinsulation piece secured to the connector body on an opposite side tothe first insulation piece.

In the module, the first integrated module may further include afeedthrough board including a feedthrough board substrate, and a firstfeedthrough board electric conductor carried by the feedthrough boardsubstrate and connected to the first connector contact, the first andsecond insulation pieces being located against and on opposite sides ofthe feedthrough board substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is further described by way of example with reference tothe accompanying drawings, wherein:

FIG. 1 is perspective view of an apparatus for testing integratedcircuits of electronic devices, according to an embodiment of theinvention;

FIG. 2 is perspective view of a door system forming part of theapparatus;

FIG. 3 is a view similar to FIG. 1 after a door panel is rotated from aclosed orientation to an open orientation;

FIG. 4 is a view similar to FIG. 3 after the door panel and upper andlower hinge bases are moved from an operational position into a storageposition;

FIG. 5 is perspective view of an interior frame that is located within atest electronics frame of the apparatus of FIG. 4;

FIG. 6 is a perspective view of the interior frame from an opposing sidethan in FIG. 5;

FIG. 7 is a cross-sectional end view through an oven portion of the testelectronics module and through an oven blower module of the apparatus;

FIG. 8 is a cross-sectional end-view from an opposing side than in FIG.7 through a driver electronics portion of the test electronics moduleand through a driver electronics blower module;

FIG. 9 is a side view illustrating components of the oven blower module;

FIG. 10 illustrates an interconnection scheme of an electric testerforming part of the test electronics module;

FIG. 11 is a perspective view of the tester of FIG. 10;

FIG. 12 is cross-sectional side view of a connector module forming partof the tester in FIG. 11;

FIG. 13 is a perspective view illustrating how the connector module ofFIG. 12 is retained on the apparatus frame;

FIG. 14 is a cross-sectional side view illustrating a connector formingpart of the connector module of FIG. 12, a feedthrough board and aburn-in board;

FIG. 15 is a perspective view of the connector of FIGS. 14; and

FIG. 16 is a top plan view of the burn-in board shown in FIG. 14.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 of the accompanying drawings illustrates an apparatus 10 fortesting integrated circuits of electronic devices such as unsingulateddies of a wafer or dies within separate integrated circuit packages. Theapparatus 10 includes a test electronics module 12, an oven blowermodule 14, and a driver electronics blower module 16. The modules 12, 14and 16 are initially separate from one another. It is easier totransport the apparatus 10 when the modules 12, 14 and 16 are separatefrom one another and the modules 12, 14 and 16 are also sized so thatthey can fit through existing doorways of fabrication facilities.

The oven blower module 14 and the driver electronics blower module 16are located side-by-side on top of the test electronics module 12.Following transportation of the modules 12, 14 and 16, the apparatus 10is assembled as shown in FIG. 1. The test electronics module 12 has atest electronics frame 18, the oven blower module 14 has an oven blowerframe 20, and the driver electronics blower module 16 has a driverelectronics frame 22. The oven blower frame 20 is then bolted to thetest electronics frame 18 and the driver electronics frame 22 is boltedto the test electronics frame 18. The test electronics frame 18, ovenblower frame 20, and driver electronics frame 22 then jointly form anapparatus frame 24 with the test electronics frame 18, oven blower frame20, and driver electronics frame 22 secured to one another. The ovenblower module 14 and the driver electronics blower module 16 can stillbe removed from the test electronics module 12 by removing the boltsthat secure the oven blower frame 20 and the driver electronics frame 22to the test electronics frame 18. It may for example be required toreplace the oven blower module 14 with another oven blower module foranother purpose. The oven blower module 14 may for example provide aircooling and may have to be replaced by an oven blower module having awater cooling capability.

As further illustrated in FIG. 1, the apparatus 10 includes a doorsystem 26, including upper and lower translation systems 28 and 30,upper and lower hinge bases 32 and 34, a connecting structure 36, a doorpanel 38 and a latch mechanism 40.

As shown in FIG. 2, the upper translation system 28 includes an upperhorizontal track 42 and an upper set of wheels 44. The track 42 issecured to the test electronics frame 18. Each one of the wheels 44 isrotatably secured to the upper hinge base 32. Each one of the wheels 44has an outer surface that rides on the track 42. The track 42 and thewheels 44 mount the upper hinge base 32 to the test electronics frame18.

Referring again to FIG. 1, the lower translation system 30 has a similartrack-and-roller arrangement as the upper translation system 28. Thelower translation system 30 thus mounts the lower hinge base 34 to thetest electronics frame 18. The connecting structure 36 is locatedbetween the upper and lower hinge bases 32 and 34 and secures the upperand lower hinge bases 32 and 34 to one another so that they move inunison.

The upper and lower hinge bases 32 and 34 are shown in an operationalposition in FIG. 1, wherein they are located to the right on the upperand lower translation systems 28 and 30. The door panel 38 is pivotallymounted to the upper and lower hinge bases 32 and 34 for pivotalmovement about a substantially vertical axis. When the upper and lowerhinge bases 32 and 34 are in the operational position as shown in FIG.1, the door panel 38 can be pivoted into a closed orientation as shownin FIG. 1, wherein the door panel 38 closes a door opening defined inthe test electronics frame 18. The latch mechanism 40 is used tomaintain the door panel 38 in the closed position.

As shown in FIG. 3, the latch mechanism 40 can be operated to releasethe door panel 38 so that it is not maintained in the closed position,whereafter the door panel 38 can be pivoted relative to the upper andlower hinge bases 32 and 34 while the upper and lower hinge bases 32 and34 are in the operational position. The door panel 38 is pivoted fromthe closed orientation shown in FIG. 1 to an open orientation shown inFIG. 3 wherein a door opening 46 in the test electronics frame 18 isopen.

Referring now to FIGS. 3 and 4 in combination, the door panel 38, aftermoving into the open orientation in FIG. 3 and with the upper and lowerhinge bases 32 and 34 in the operational position, can be moved to astorage position shown in FIG. 4, wherein the door panel 38 is locatedadjacent the test electronics frame 18. The upper and lower hinge bases32 and 34, the connecting structure 36 and the door panel 38 move inunison into the storage position shown in FIG. 4.

In the storage position shown in FIG. 4, a passageway in front of thedoor opening 46 is not blocked by the door panel 38. There is thus noneed to close the door panel 38 in order to allow for movement throughthe passage.

In order to again close the door opening 46, the door panel 38 togetherwith the upper and lower hinge bases 32 and 34 and the connectingstructure 36 are moved from the storage position shown in FIG. 4 to theposition in FIG. 3 wherein the upper and lower hinge bases 32 and 34 arein the operational position and the door panel 38 is in the openorientation. The door panel 38 is then moved from the open orientationshown in FIG. 3 to the closed orientation shown in FIG. 1. The latchmechanism 40 is operated to maintain the door panel 38 in the closedorientation.

FIGS. 5 and 6 illustrate an interior frame 50 and first, second, third,fourth, fifth and sixth sets of rails 52A, 52B, 52C, 52D, 52E and 52F,respectively, located on the interior frame 50. The interior frame 50 isconfigured with additional electronics boards (not shown) that arelocated on the rails 52C, 52D, 52E and 52F, whereafter the interiorframe 50 is located with the electronics boards and connectors mountedto the electronics boards through a rear door opening (not shown) inFIG. 1 into the test electronics frame 18. Electronic devices are heldby a device-holder subassembly such as a burn-in board (not shown) andthe burn-in board is located on the rails 52A and 52B and connected tothe electronics boards located on the rails 52C, 52D, 52E and 52F.

The interior frame 50 has first, second, third, fourth, and fifthvertical sides 54A, 54B, 54C, 54D and 54E. The vertical sides 54A and54B oppose one another and the rails 52A and 52B are located on thevertical sides 54A and 54B, respectively. Each one of the rails 52A thusopposes a respective one of the rails 52B. The vertical sides 54C and54D oppose one another and the rails 52C and 52D are located on thevertical sides 54C and 54D, respectively. The vertical sides 54D and 54Eoppose one another and the rails 52E and 52F are located on the verticalsides 54D and 54E, respectively. The rails 52C and 52D oppose oneanother. The rails 52E and 52F oppose one another.

The interior frame 50 also has horizontal oven panels 56 that connectthe vertical sides 54A and 54B to one another to form a subassembly andtest electronics panels 58 that connect the vertical sides 54C, 54D and54E to one another to form a subassembly. The subassembly formed by theoven panels 56 and the vertical sides 54A and 54B is secured to thesubassembly formed by the test electronics panels 58 and the verticalsides 54C, 54D and 54E to complete the construction of the interiorframe 50. The interior frame 50 is thus a free standing unit before itis inserted into the test electronics frame 18 of FIG. 4 and before itis loaded with electronics boards. The interior frame 50 can also beremoved out of the test electronics frame 18 for purposes ofreconfiguring the system.

The vertical sides 54A, 54B, 54C, 54D, and 54E are made out of verticalstrips 60 with spaces between the vertical strips 60. The spaces betweenthe vertical strips 60 provide openings so that air can flowhorizontally through the vertical sides 54A, 54B, 54C, 54D, and 54E intoand out of the interior frame 50.

FIG. 7 illustrates further components of the apparatus 10 including anoven blower 62 and an air channeling piece or damper 64 forming part ofthe oven blower module 14 and inlet and outlet plenums 66 and 68 formingpart of the test electronics module 12.

The oven blower 62 has first and second blower bearings 70 and 72, ablower input shaft 74, and an centrifugal fan 76. The centrifugal fan 76is mounted to the shaft 74. The shaft 74 is rotatably mounted on theoven blower frame 20 by the first and second bearings 70 and 72.

The damper 64 is mounted to the oven blower frame 20. Air can pass overa surface of the air channeling piece 64 into an inlet of thecentrifugal fan 76.

The plenums 66 and 68 are mounted to the test electronics frame 18 onopposing sides of the interior frame 50 (see FIG. 5) such that theplenum 66 is located next to the vertical side 54A and the plenum 68 islocated next to the vertical side 54B. The plenum 66 forming part of thetest electronics module 12 receives air from an outlet of thecentrifugal fan 76 forming part of the oven blower module 14. The plenum68 forming part of the test electronics module 12 delivers air over thesurface of the air channeling piece 64 forming part of the oven blowermodule 14.

In use, burn-in boards are positioned between the vertical sides 54A and54B. When power is provided to devices held by the burn-in boards, thedevices and the burn-in boards generate heat. Heat is also provided, ifneeded, by a heater (not shown). The centrifugal fan 76 and the shaft 74rotate on the first and second bearings 70 and 72 relative to the ovenblower frame 20. The centrifugal fan 76 receives air from the plenum 68over the surface of the damper 64 and provides air to the plenum 66.Parallel streams of air pass from the plenum 66 through the verticalside 54A over the burn-in boards to the plenum 68. Air continues tocirculate through the test electronics module 12 and the oven blowermodule 14 so that air within an oven portion of the test electronicsmodule 12 is at substantially the same temperature as air within theoven blower module 14. The air continues to heat up as the burn-inboards, devices and heater generate more heat. When the temperaturewithin the test electronics module 12 reaches a predeterminedtemperature, the damper 64, forming part of the oven blower module 14 isopened to atmosphere and the heater is turned off. Air at close toatmospheric temperature is then drawn into the centrifugal fan 76 andheated air from the plenum 68 is vented to atmosphere. Excess heat isthereby removed from the apparatus 10. The heater and damper worktogether to control the temperature of the air in the chamber.

FIG. 8 shows further components of the apparatus 10 including a driverelectronics blower 80 forming part of the driver electronics blowermodule 16, and inlet and outlet plenums 82 and 84 forming part of adriver electronics part of the test electronics module 12. Electronicsboards are positioned between the vertical sides 54C and 54D and moreelectronics boards are positioned between the vertical sides 54D and54E.

In use, the electronics boards positioned between the vertical sides 54Cand 54D and between the vertical sides 54D and 54E generate heat. Thedriver electronics blower 80 receives air from outside the apparatus 10at atmospheric temperature and provides the air to the plenum 82.Parallel streams of air flow from the plenum 82 to the plenum 84. Eachstream of air passes through the vertical side 54C over an electronicsboard located between the vertical side 54C and the vertical side54D,through the vertical side 54D over an electronics board locatedbetween the vertical side 54D and the vertical side 54E and through thevertical side 54E to the plenum 84. The air then flows from the plenum84 through the driver electronics blower module 16 to atmosphere. It canthus be seen that heat is continually removed from the driverelectronics portion of the test electronics module 12.

FIG. 9 illustrates further components of the oven blower module 14 shownin FIG. 7, including a blower bearing mount 90, a spacer component 92, ablower motor 96, a blower motor pulley 98, a blower pulley 100, and adrive belt 102.

The blower motor 96 includes a blower motor body 108, a blower motorstator 110, a blower motor rotor 112, and a blower motor output shaft114. The blower motor body 108 is mounted in a stationary position onthe oven blower frame 20. The blower motor stator 110 is mounted in astationary position within the blower motor body 108. The blower motoroutput shaft 114 is mounted to the blower motor body 108 for rotationabout an axis of the blower motor output shaft 114. The blower motorrotor 112 is mounted to the blower motor output shaft 114 within theblower motor body 108. One skilled in the art will appreciate thatalternating current is provided to the blower motor stator 110. Thealternating current within the blower motor rotor 112 creates analternating magnetic field that induces rotation of the blower motorrotor 112 and the blower motor output shaft 114.

The spacer component 92 is located between the blower bearing mount 90and the oven blower frame 20, whereafter the blower bearing mount 90 andthe spacer component 92 are secured to the oven blower frame 20. Thesecond blower bearing 72 is held the blower bearing mount 90 and theblower input shaft 74 is held by the second blower bearing 72. Anotherblower bearing mount (not shown) is used to mount the first blowerbearing 70 (FIG. 7) to the oven blower frame 20.

The blower motor pulley 98 and the blower pulley 100 are mounted to theblower motor output shaft 114 and the blower input shaft 74 respectivelyso that they rotate in unison therewith. The drive belt 102 forms aclosed loop that runs over the blower motor pulley 98 and the blowerpulley 100. An outer surface of the drive belt 102 also runs over anidler roller 116, which is used to tension the drive belt 102. The drivebelt 102 provides a transmission of power from the blower motor pulley98 to the blower pulley 100, and therefore from the blower motor 96 tothe centrifugal fan 76.

It should be noted that the terms “pulley” and “belt” should begenerically interpreted as encompassing equivalent components such as a“gear” or a “chain,” respectively.

The blower pulley 100 is located between the blower bearing mount 90 andthe blower bearing mount (not shown) that is used to secure the firstblower bearing 70 in FIG. 7. The drive belt 102 can however be removedwithout entirely disconnecting the oven blower 62 (FIG. 7) from the ovenblower frame 20. Bolts and nuts that secure the blower bearing mount 90and the spacer component 92 to the oven blower frame 20 are undone.Undoing of the nuts and bolts, permits for the spacer component 92 to beremoved. After the spacer component 92 is removed, the drive belt 102can be slipped over the blower bearing mount 90, without removing theblower bearing mount 90 or the blower bearing mount that is used tosecure the first blower bearing 70 in FIG. 7 from the shaft 74. A newdrive belt (not shown) can then be slipped over the blower bearing mount90, whereafter the spacer component 92 is positioned between the blowerbearing mount 90 and the oven blower frame 20, and the blower bearingmount 90 and the spacer component 92 are again secured to the ovenblower frame 20 using the bolts and nuts. The new drive belt is thenpositioned over the blower motor pulley 98 and the blower pulley 100 andis then tensioned with the idler roller 116.

FIG. 10 illustrates a connection scheme by components of an electrictester 120, including driver boards 122, 124, 126 and 128, first andsecond backplane boards 130 and 132, and first and second feedthroughboards 134 and 136.

The driver boards 122 and 124 are power boards and the driver boards 126and 128 are signal boards. Each one of the driver boards 122,124, 126and 128 has a respective driver board substrate 138. The driver boardsubstrates 138 are separate from one another. The driver board substrate138 of the driver boards 122 and 126 are positioned in an upperhorizontal plane and the driver board substrate 138 of the driver boards124 and 128 are located in a lower horizontal plane.

The driver board 122 has a plurality of driver board electric conductors140A-F carried by the driver board substrate 138 thereof. The driverboards 124, 126 and 128 each has a respective driver board electricconductor 140G, H and I, respectively carried by a respective driverboard substrate 138.

Each one of the backplane boards 130 and 132 has a respective backplaneboard substrate 142. The backplane board substrates 142 are positionedin a vertical plane that intersects the horizontal planes of the driverboard substrates 138. The backplane board substrates 142 are separatefrom one another so that the backplane boards 130 and 132 are notdirectly connected to one another.

The backplane board 130 has a plurality of backplane board electricconductors 144A-C that are carried by the backplane board substrate 142thereof. The backplane board 132 has a backplane board electricconductor 144D carried by the backplane board substrate 142 thereof.

The feedthrough boards 134 and 136 each have a respective feedthroughboard substrate 146. The feedthrough board substrate 146 of thefeedthrough board 134 may or may not be located in the same horizontalplane as the driver board substrates 138 of the driver boards 122 and126. The feedthrough board substrate 146 of the feedthrough board 136may or may not be located in the same horizontal plane as the driverboard substrates 138 of the driver boards 124 and 128. The feedthroughboards 134 and 136 are located on an opposite side of the plane of thebackplane boards 130 and 132 than the driver boards 122, 124, 126 and128.

The feedthrough board 134 has a plurality of feedthrough board electricconductors 148A-I that are carried by the feedthrough board substrate146 thereof. The feedthrough board 136 has a plurality of feedthroughboard electric conductors 148J-S carried by the feedthrough boardsubstrate 146 thereof.

The driver-board electric conductor 140A extends in a x-direction to anedge 150 of the driver board substrate 138 of the driver board 122. Theedge 150 extends in a z-direction. The driver board electric conductor140A connects through connectors and conductors (not shown) of thebackplane board 130 to the feedthrough board electric conductor 148A.The feedthrough board electric conductor 140A extends in a z-directionand is connected to the backplane board electric conductor 144D. Thebackplane board electric conductor 144D extends in a y-direction and isconnected to the feedthrough board electric conductor 148J. Thefeedthrough board electric conductor 148J extends in a z-direction andis connected to the feedthrough board electric conductor 148K. Thefeedthrough board electric conductor 148K extends in a x-direction to anedge 152 of the feedthrough board substrate 146. The edge 152 extends ina z-direction.

It can thus be seen that an end of the feedthrough board electricconductor 148K at the edge 152 is in a different horizontal and adifferent vertical plane than an end of the driver board electricconductor 140A at the edge 150. The feedthrough board electricconductors 148A and 148J provide for connection to a different verticalplane and the backplane board electric conductor 144D provides forconnection to a different horizontal plane. Specifically, thefeedthrough board electric conductor 148K is off-set from a line atright angles to the edge 150 at a terminal connected to the driver boardelectric conductor 140A. What should also be noted is that, although thebackplane electric conductor 144D extends in a direction at right anglesto a horizontal plane of the driver board substrate 138 of the driverboard 122, the feedthrough board electric conductors 148A and 148J donot extend in a direction at right angles to the plane of the driverboard substrate 138 of the driver board 122.

A further electric connection is provided by the driver board electricconductor 140B and the feedthrough board electric conductors 148B-I.Specifically, the feedthrough board electric conductor 148C provides forhorizontal interconnection in a z-direction to distribute resources fromthe driver board electric conductor 140B to multiple locations along anedge 154 of the feedthrough board substrate 146 of the feedthrough board134.

A similar arrangement is provided by the driver board electric conductor140C and the feedthrough board electric conductors 148L-S. In thisarrangement, the backplane board electric conductor 144A provides forinterconnection from an upper horizontal plane of the driver board 122to a lower horizontal plane of the feedthrough board 136.

As noted, the driver board electric conductors 140A-C provide resourcessuch as signal, power or ground to the feedthrough boards 134 and 136.The driver board electric conductors 140D-F are used for communicationbetween the driver board 122 and the driver boards 124, 128 and 126,respectively.

The driver board electric conductor 140D extends to the edge 140 and isconnected to the backplane board electric conductor 144B. The backplaneboard electric conductor 144B extends in a y-direction and is connectedto the driver board electric conductor 140G. The backplane boardelectric conductor 144B thus provides for connection from an upperhorizontal plane of the driver board 122 to a lower horizontal plane ofthe driver board 126.

The driver board electric conductor 140E extends to the edge 150 and isconnected to the backplane board electric conductor 144C. The backplaneboard electric conductor 144C extends in a y-direction and is connectedto the feedthrough board electric conductor 148U. The feedthrough boardelectric conductor 148U extends in a z-direction and is connectedthrough connectors and conductors (not shown) of the backplane board 132to the driver board electric conductor 1401. The backplane boardelectric conductor 144C provides interconnection from an upperhorizontal plane to a lower horizontal plane and the feedthroughelectric conductor 148U provides interconnection from one vertical planeto another vertical plane.

The driver board electric conductor 140F is connected through connectorsand conductors (not shown) of the backplane board 130 to a feedthroughboard electric conductor 148T of the feedthrough board 134. Thefeedthrough board electric conductor 148T extends in a z-direction andis connected through connectors and conductors (not shown) of thebackplane board 132 to the driver board electric conductor 140H. Thefeedthrough board electric conductor 148T thus provides forinterconnection from one vertical plane to another.

All the interconnection schemes that are described with reference toFIG. 10 originate at the driver board 122. It should however beunderstood that similar connection schemes originate from the driverboards 124, 126 and 128.

As will be commonly understood, the horizontal planes extend in x- andz-directions and the vertical plane described herein extends in y- andz-directions. It will also be understood that the x-, y-, andz-directions are at angles other than 0° relative to one another,specifically at right angles to one another. It will also be appreciatedthat vertical and horizontal planes are at an angle other than 0°relative to one another, more specifically at right angles to oneanother.

FIG. 11 shows further components of the electric tester 120, includingfirst and second sets of backplane connectors 160 and 162, and aplurality of integrated feedthrough modules 166.

The driver board connectors 164 are secured to the respective driverboard substrates 138. The driver boards 122, 126 and 128 are positionedon respective sets of rails 52C-52F. For example, the opposing sides ofthe driver board 126 are supported on one of the rails 52E and one ofthe rails 52F.

The first and second backplane connectors 160 and 162 are secured toopposing sides of either of the substrates 142 and form part of eitherof the backplane boards 130 or 132. The backplane board 130 and 132 aremounted to portions of the frame 50. The driver boards 122, 124, 126 and128 are moved on the rails 52C-52F until the driver board connectors 164engage with the first backplane connectors 160. Contacts and terminalson the first backplane connectors 160 and the driver board connectors164 connect the backplane 130 and 132 electrically to the driver boards122, 124, 126 and 128. The second backplane connectors 162 are connectedthrough conductors in the backplane substrate 142 to the first backplaneconnectors 160.

Each one of the integrated feedthrough modules 166 has a firstfeedthrough module connector 170 that is secured to the feedthroughboard substrate 146. The first feedthrough module connector 170 hascontacts and terminals that connect the feedthrough board, e.g. thefeedthrough board 136 electrically to one of the second backplaneconnectors 162.

FIG. 12 illustrates further components of the integrated feedthroughmodule 166, including a second connector 172, first, second and thirdpieces of insulation, 174, 176 and 178 respectively, a first fastener180, a stabilizing piece 182, and a second fastener 184.

The first insulation piece 174 has a lower surface 186 that is locatedagainst an upper surface of the feedthrough board 136 and the secondinsulation 176 has an upper surface 188 that is located against a lowersurface of the feedthrough board 136. The fastener 180 has a shank 190and a larger head 192. The shank 190 is inserted into complementaryopenings in the first and second insulation pieces 174 and 176. A lowerend of the shank 190 has thread 194 that engages with complementarythread of the second insulation piece 176. The head 192 is larger thanthe opening in the first insulation piece 174. The first fastener 180thus secures the first and second insulation pieces 174 and 176 to thefeedthrough board 136.

The second fastener 184 has a shank 196 and a head 198. The shank 196 isinserted through an opening in the upper portion of the stabilizingpiece 182. The shank 196 has thread that engages with complementarythread of the first insulation piece 174. The head 198 engages with thestabilizing piece 182 so that the second fastener 184 secures thestabilizing piece 182 to the first insulation piece 174. The thirdinsulation piece 178 is located on an inner surface of the stabilizingpiece 182. The stabilizing piece 182 has a connector opening 200 formedtherein. The second connector 172 is inserted though the connectoropening 200. The second connector 172 engages structurally andelectrically with the feedthrough board 136. It may also be possible toremove the second connector 172 from the feedthrough board 136 byextracting the second connector 172 out of the connector opening 200.

Referring again to FIG. 11, it can be seen that the integratedfeedthrough modules 166 are located adjacent one another with a smallgap between them. The small gap is filled with an additional insulatingpiece so that the integrated feedthrough modules 166 and the additionalinsulating piece form an insulating wall. In another arrangement, theintegrated feedthrough modules 166 contact one another so that they forman insulating wall without an additional insulating piece. Because aninsulating wall is formed by the integrated feedthrough modules 166,there is no need for an additional insulating wall to insulate thetester 120 from the second connectors 172. The connectors 172 can thusbe held at higher temperatures of an oven and the electric tester 120can be maintained at a lower temperature.

It may happen from time to time that one of the integrated feedthroughmodules 166 fails and has to be replaced. The integrated feedthroughmodule 166 can be removed by simply extracting the first feedthroughconnector module 166 from the corresponding second backplane connector163. Another integrated feedthrough module 166 can be then be positionedin its place. The insulating wall will be broken when the failedintegrated feedthrough module 166 is removed, but the insulating wall isagain restored when the replacement integrated feedthrough module 166 isinserted.

FIG. 13 shows a retaining piece 202 that is mounted to the frame 50 by aplurality of fasteners 204. The retaining piece 202 has a first portion206 located against and secured to the frame 50, and a second portion208 located over a plurality of the integrated feedthrough modules 166.The retaining piece 202 prevents movement of the integrated feedthroughmodule 166 relative to the frame 50 when a burn-in board is disconnectedfrom the second connector 172.

FIG. 14 shows the connector 172, the feedthrough board 136 and a burn-inboard 212 in more detail.

The connector 172 includes a connector body 214 and first, second, thirdand fourth conductors 216, 218, 220 and 222 that are carried by theconnector body 214.

The first conductor 216 includes a first connector terminal 224, a firstterminal spring portion 226, a first connector conductor 228, a firstcontact spring portion 230, and a first connector contact 232. Theconnector body 214 has a long outer portion 233 and a short innerportion 235. The first connector conductor 228 is held between the longouter portion 233 and the short inner portion 235 in an upper half ofthe connector body 214. The first terminal spring portion 226 and thefirst contact spring portion 230 extend from opposing ends of the firstconnector conductor 228. The first connector terminal 224 and the firstconnector contact 232 are located at ends of the first terminal springportion 226 and the first contact spring portion 230, respectively. Thefirst connector terminal 224 can be depressed in an upward directionagainst a spring force that is created by the first terminal springportion 226. Similarly, the first connector contact 232 can be depressedin an upward direction against a spring force that is created by thefirst contact spring portion 230. Removal of a pressure that depressesthe first connector spring terminal 224 or the first connector contact232 results in downward movement of the first connector terminal 224 orthe first connector contact 232.

The second conductor 218 includes a second connector terminal 234, asecond terminal spring portion 236, a second connector conductor 238, asecond contact spring portion 240, and a second connector contact 242.The second connector conductor 238 is located on a lower surface of theshort inner portion 235. The second terminal spring portion 236 and thesecond contact spring portion 240 extend from opposing ends of thesecond connector conductor 238. The second connector terminal 234 andthe second connector contact 242 are located at ends of the secondterminal spring portion 246 and the second contact spring portion 240,respectively. The second connector terminal 234 can be depressed in anupward direction against a spring force that is created by the secondterminal spring portion 236. Similarly, the second connector contact 242can be depressed in an upward direction against a spring force that iscreated by the second contact spring portion 240. Removal of a pressurethat depresses the second connector spring terminal 234 or the secondconnector contact 242 results in downward movement of the secondconnector terminal 234 or the second connector contact 242.

The third conductor 222 includes a third connector terminal 244, a thirdterminal spring portion 246, a third connector conductor 248, a thirdcontact spring portion 250, and a third connector contact 252. The thirdconnector conductor 248 is held between the long outer portion 233 andthe short inner portion 235 in a lower half of the connector body 214.The third terminal spring portion 246 and the third contact springportion 250 extend from opposing ends of the third connector conductor248. The third connector terminal 244 and the third connector contact252 are located at ends of the third terminal spring portion 256 and thethird contact spring portion 250, respectively. The third connectorterminal 244 can be depressed in a downward direction against a springforce that is created by the third terminal spring portion 246.Similarly, the third connector contact 252 can be depressed in adownward direction against a spring force that is created by the thirdcontact spring portion 250. Removal of a pressure that depresses thethird connector spring terminal 244 or the third connector contact 252results in upward movement of the third connector terminal 244 or thethird connector contact 252.

The fourth conductor 220 includes a fourth connector terminal 254, afourth terminal spring portion 256, a fourth connector conductor 258, afourth contact spring portion 260, a fourth connector contact 264, andthe fourth connector conductor 258 is located on an upper surface of theshort inner portion 235. The fourth terminal spring portion 256 and thefourth contact spring portion 260 extend from opposing ends of thefourth connector conductor 258. The fourth connector terminal 254 andthe fourth connector contact 264 are located at ends of the fourthterminal spring portion 256 and the fourth contact spring portion 260,respectively. The fourth connector terminal 254 can be depressed in adownward direction against a spring force that is created by the fourthterminal spring portion 256. Similarly, the fourth connector contact 264can be depressed in a downward direction against a spring force that iscreated by the fourth contact spring portion 260. Removal of a pressurethat depresses the fourth connector spring terminal 254 or the fourthconnector contact 264 results in upward movement of the fourth connectorterminal 254 or the fourth connector contact 264.

Each conductor 216, 218, 220 and 222 terminates into lips 270. A gap isdefined between the first connector terminal 224 and the third connectorterminal 244 and the lips 270 near the first connector terminal 224 andthe third connector terminal 244 define a gap that is wider than the gapbetween the first connector terminal 224 and the third connectorterminal 244. The other lips 270 also define a gap between them that iswider than a respective pair of terminals or contacts near therespective lips.

The second connector terminal 234 is behind the first connector terminal224 in a direction from left-to-right. Similarly, the fourth connectorterminal 254 is behind the third connector terminal 244 in a directionfrom left-to-right. The second connector contact 242 is behind the firstconnector contact 232 in a direction from right-to-left. Similarly, thefourth connector contact 264 is behind the third connector contact 252in a direction from right-to-left. 101491 The feedthrough board 136includes a feedthrough board substrate 148 as described with referenceto FIG. 10, four feedthrough board electric conductors 148 V, U, W andX, and first, second, third and fourth feedthrough board terminals 272,274, 275 and 278. The feedthrough board electric conductors 148 V, U, Wand X are similar to the feedthrough board conductors described withreference to FIG. 10, except that they are all in the same plane. Thefirst, second, third and fourth feedthrough board terminals 272, 274,275 and 278 are connected to the feedthrough board electric conductors148 U, V, X and W, respectively. The first and second feedthrough boardterminals 272 and 274 are located on an upper surface of the feedthroughboard substrate 148 with the first feedthrough board terminal 272located to the right of the second feedthrough board terminal 274. Thethird and fourth feedthrough board terminals 275 and 278 are located ona lower side of the feedthrough board substrate 146 with the thirdfeedthrough board terminal 275 to the right of the fourth feedthroughboard terminal 278.

In use, a left edge of the feedthrough board 136 is inserted between thelips 270 and urge the first connector contact 232 and the thirdconnector conductor 252 apart. The first connector contact 232 and thethird connector conductor 252 are then located on upper and lowersurfaces of the feedthrough board 136.

The feedthrough board 136 is then inserted further into the connector172 until the left edge of the feedthrough board 136 urges the lips 270near the second connector contact 242 and the fourth connector contact264 apart. As the feedthrough board 136 moves further into the connector172, it comes into a stationary position, wherein the first connectorcontact 232 makes contact with the first feedthrough board terminal 272,the second connector contact 242 makes contact with the secondfeedthrough board terminal 274, the third connector contact 252 makescontact with the third feedthrough board terminal 275, and the fourthconnector contact 264 makes contact with the fourth feedthrough boardterminal 278. It can thus be seen that four contacts 230, 242. 252 and264 of the connector 172 are connected to four feedthrough boardterminals 272, 274, 275 and 278 located in the same plane.

The burn-in board 212 includes a burn-in board substrate 280, first,second, third and fourth burn-in board contacts 282, 284, 286 and 288,respectively, and first, second, third and fourth burn-in board electricconductors 290A-290D. The first and second bum-in board contacts 282 and284 are located on an upper side of the burn-in board substrate 280 andthe third and fourth burn-in board contacts 286 and 288 are located on alower side of the burn-in board substrate 280. The first burn-in boardcontact 282 is located to the left of the second burn-in board contact284. The third burn-in board contact 286 is located to the left offourth burn-in board contact 288.

In use, the burn-in board 212 is inserted from left to right into theconnector 172 between the lips 270 near the first and third connectorterminals 224 and 244. The burn-in boards 212 urge the first and secondconnector terminals 224 and 244 apart against spring forces by the firstand third terminal spring portions 226 and 246. The first and thirdconnector terminals 224 and 244 slide on upper and lower sides of theburn-in board 212 as the burn-in board 212 is further inserted into theconnector 172. The burn-in board 212 is eventually located in astationary position wherein the first, second, third and fourthconnector terminals 224, 234, 244 and 254 simultaneously make contactwith the first, second, third and fourth burn-in board contacts 282,284, 286 and 288, respectively, all located in the same vertical plane.The burn-in board 212 can also be removed to the left out of theconnector 172.

As shown in FIG. 15, the connector 172 has a plurality of firstconductors 216 and a corresponding plurality of third conductor 222.Although not shown in FIG. 15, it will be appreciated that the connector172 also has a corresponding plurality of second and third conductors(reference numerals 218 and 220 in FIG. 14).

FIG. 16 illustrates further components of the burn-in board 212,including a plurality of sockets 292, a ground electric conductor 290G,a power electric conductor 290P, and two signal electric conductors290Si and 290SiiThe sockets 292 are mounted to the burn-in boardsubstrate 280. The electric conductors 290G, 290P, 290Si and 290Sii aresimilar to the electric conductors 290A-290D described with reference toFIG. 14. The electric conductors 290G, 290P, 290Si and 290Sii connectrespective ones of the burn-in board contacts 282 and 284 to terminalswithin the sockets 292. The sockets 292 are designed to realeasably holdand retain electronic devices in the form of integrated circuitpackages. Each integrated circuit package has a substrate and a diecarrying an integrated circuit mounted to the substrate. The packagealso includes contacts or wire-bonding wires to connect the integratedcircuit and the die electrically to the packaged substrate. The packagealso includes an encapsulant to protect the die. Although not shown inFIG. 16, it should be appreciated that there are more ground, power andsignal electric conductors than the ground, power and signal electricconductors 290G, 290P, 290Si and 290Sii that are shown in FIG. 16. Itwill also be appreciated that the third and fourth burn-in boardcontacts 286 and 288 shown in FIG. 14 are located on an opposite side ofthe burn-in board substrate 280 in FIG. 16 and are similarly connectedto the sockets 292 shown in FIG. 16.

In use, the burn-in board 212 and other similar burn-in boards areinserted through the door opening 46 shown in FIG. 3 and are located onthe rails 52A and 52B shown in FIG. 5. The door panel 38 is then closedas shown in FIG. 1. Power, ground and signals are provided from thedriver boards 122, 124, 126 and 128 in FIG. 10 to and from the sockets292 in FIG. 16. The temperature gradually raises in an area around theburn-in boards and the temperature is controlled by the oven blower 62,the heater and the damper described with reference to FIG. 7. Oncetesting of the electronic devices is completed, the door panel 38 ismoved into the position shown in FIG. 4 and the burn-in boards are againremoved through the door opening 46.

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative and not restrictive of the current invention, andthat this invention is not restricted to the specific constructions andarrangements shown and described since modifications may occur to thoseordinarily skilled in the art.

1-48. (canceled)
 49. A device holder subassembly, comprising: a deviceholder substrate; a plurality of device holder terminals on the deviceholder substrate, each for contacting a respective contact on arespective electronic device; a plurality of device holder signalcontacts secured to the device holder substrate, each device holdersignal contact having a surface for releasably mating with a respectivesurface of a respective signal connector terminal; a plurality of deviceholder signal conductors connecting the device holder signal contacts todevice holder terminals connected to signal contacts on the electronicdevices; a power contact secured to the device holder substrate, thepower connector having a contact surface for releasably mating with arespective surface of a respective power connector terminal; and atleast one device holder power conductor connecting the device holderboard power contact to a power contacts on one of the electronicdevices, wherein the device holder contacts are for mating the connectorterminals, the connector terminals including first and second sets ofconnector terminals, the second set of connector terminals being spacedfrom the first set of connector terminals in a direction that the deviceholder engages with the connector body.
 50. The device holdersubassembly of claim
 49. wherein the device holder includes first andsecond sets of device holder contacts spaced from one another on adevice holder substrate and contacting the first and second sets ofconnector terminals respectively.
 51. A module comprising: a firstconnector including: a connector body; a first set of connectorterminals on the connector body for connecting to respective ones of afirst set of device holder contacts of a device holder; a first set ofconnector contacts on the connector body for connecting to respectiveones of a first set of board terminals of a board; a first set ofconnector conductors carried by the connector body and connecting thefirst set of connector terminals to the first set of connector contacts;and a second set of connector terminals on the connector body, thesecond set of connector terminals being spaced from the first set ofconnector terminals in a direction that the device holder engages withthe connector body; a feedthrough board including: a feedthrough boardsubstrate; and a first feedthrough board electric conductor carried bythe feedthrough board substrate and connected to the first connectorcontact.
 52. The module of claim 51, further comprising: a second set ofconnector contacts on the connector body, the second set of connectorcontacts being spaced from the first set of connector contacts in adirection that the board engages with the connector body.
 53. The moduleof claim 52, wherein the first set of connector conductors connect thefirst connector terminals with the first connector contacts, furthercomprising: a second set of connector conductors connecting the secondset of connector contacts with the second set of connector terminals.54. The module of claim 53, wherein the board includes first and secondsets of board terminals spaced from one another on a board substrate andcontacting the first and second sets of connector contacts respectively.55. The module of claim 51, further including: a first insulation piecesecured against the connector body, the first insulation piece beinglocated against the feedthrough board substrate.
 56. (canceled)
 57. Themodule of claim 55, wherein the first integrated module includes: asecond insulation piece secured to the connector body on an oppositeside to the first insulation piece. 58-65. (canceled)
 66. A modulecomprising: (i) a first connector including: a connector body; a firstset of connector terminals on the connector body for connecting torespective ones of a first set of device holder contacts of a deviceholder; a first set of connector contacts on the connector body forconnecting to respective ones of a first set of board terminals of aboard; and a first set of connector conductors carried by the connectorbody and connecting the first set of connector terminals to the firstset of connector contacts; and (ii) an insulation piece secured againstthe connector body.
 67. The module of claim 66, further comprising: asecond set of connector terminals on the connector body, the second setof connector terminals being spaced from the first set of connectorterminals in a direction that the device holder engages with theconnector body.
 68. The module of claim 67, wherein the device holderincludes first and second sets of device holder contacts spaced from oneanother on a device holder substrate and contacting the first and secondsets of connector terminals respectively.
 69. The module of claim 66,wherein the first integrated module includes: a feedthrough boardincluding: a feedthrough board substrate; and a first feedthrough boardelectric conductor carried by the feedthrough board substrate andconnected to the first connector contact, the first insulation piecebeing located against the feedthrough board substrate.
 70. The module ofclaim 66, wherein the first integrated module includes: a secondinsulation piece secured to the connector body on an opposite side tothe first insulation piece.
 71. The module of claim 70, wherein thefirst integrated module includes: a feedthrough board including: afeedthrough board substrate; and a first feedthrough board electricconductor carried by the feedthrough board substrate and connected tothe first connector contact, the first and second insulation piecesbeing located against and on opposite sides of the feedthrough boardsubstrate. 72-98. (canceled)